International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
Keynote: 2.5D/3D Integration for High-Speed Light Engines
Date: Wednesday, October 9, 2024
Time: 8:45 a.m.
Marvell panelist: Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer of Optical Platforms
InterPACK 2024
October 8-10, 2024
San Jose, CA
Nov 05, 2024
Oct 15, 2024
Copyright © 2024 Marvell, All rights reserved.