By Vienna Alexander, Marketing Content Professional, Marvell
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At the Heterogeneous Composable and Disaggregated Systems (HCDS) Workshop, co-located with Architectural Support for Programming Languages and Operating Systems (ASPLOS), Senior Staff Engineer Jing Ding won Best Paper for her research on the Marvell® Photonic Fabric™ Technology Platform.
There is a critical mismatch between the capacity and bandwidth available across memory tiers and the demands of large-scale LLM inference, revealed through characterizing KV cache retrieval efficiency. In fact, across LLaMA3-8B to 405B on NVIDIA A100/H200 systems, retrieving KV cache from host memory achieves up to 100x speedup over GPU re-computation for contexts up to 4M tokens, but host DRAM capacity cannot accommodate the KV demands of long-context, multi-tenant and multi-turn workloads.
While CXL-enabled memory pooling could be applied in this capacity, it faces fundamental electrical interconnect limitations, namely rack-scale distance constraints, switch contention under multi-host workloads, and power-thermal scaling challenges. By leveraging the Photonic Fabric™ optical interconnect technology platform to break reach limitations, along with CXL as a host communication protocol, Marvell enables a unique pod-scale memory sharing appliance that can enable up to 16 servers across multiple racks to dynamically share up to 32 TB of memory capacity.
By Vienna Alexander, Marketing Content Professional, Marvell
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In the 13th annual Lightwave Innovation Reviews, Marvell received awards for two of its optical connectivity products: the active copper cable (ACC) linear equalizers and 1.6T silicon photonics light engine. Both products received a 4.0 outstanding honoree status on the 5.0 scale, which is defined as an excellent product with technical features and performance that provide clear, substantial benefits.
An esteemed panel of independent judges evaluated optical communications and broadband designs to showcase the most innovative products, technologies, and programs that have a significant impact on the semiconductor industry.
By Vienna Alexander, Marketing Content Professional, Marvell
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The first-ever edition of the America’s Most Charitable Companies 2026 award, presented by Newsweek and Statista, commends Marvell as one of the nation’s leaders in community impact.
The new ranking selected the top 300 companies that fared best in surveys of over 18,000 U.S. respondents, along with KPI philanthropy metrics, social listening, and other thorough research. Marvell has been awarded other distinctions in Newsweek and Statista collaborations, which, in combination with this new humanitarian ranking, further position Marvell as a trustworthy company.
By Vienna Alexander, Marketing Content Professional, Marvell

In the Product of the Year Awards, Electronic Design News (EDN) named Marvell as the winner of the Interconnects category for its 3nm 1.6T PAM4 Interconnect Platform, known as Ara. Ara is the industry’s first 3nm PAM4 DSP specializing in bandwidth, power efficiency and integration for AI and data center scale-out accelerated infrastructure.
These awards are a 50-year tradition that recognizes outstanding products that demonstrate significant technological advancement, especially innovative design, or a substantial improvement in price or performance. Over 100 products were evaluated spanning 13 categories to determine the winners.
The Ara 3nm 1.6T PAM4 DSP integrates eight 200G electrical lanes and eight 200G optical lanes in a compact, standardized module form factor. Ara sets a new standard in optical interconnect technology, integrating advanced laser drivers and signal processing into a singular device, thereby reducing power per bit. With the product, system design is simplified across entire AI data center network stacks. Power consumption is also reduced, enabling denser optical connectivity and faster deployment of AI clusters.
Ara has also received other recognitions, demonstrating Marvell leadership in optical DSPs and the interconnect realm.
By Sandeep Bharathi, president, Data Center Group, Marvell
This blog was originally posted at Fortune.
Semiconductors have transformed virtually every aspect of our lives. Now, the semiconductor industry is on the verge of a profound transformation itself.
Customized silicon—chips uniquely tailored to meet the performance and power requirements of an individual customer for a particular use case—will increasingly become pervasive as data center operators and AI developers seek to harness the power of AI. Expanded educational opportunities, better decision making, ways to improve the sustainability of the planet all become possible if we get the computational infrastructure right.
The turn to custom, in fact, is already underway. The number of GPUs—the merchant chips employed for AI training and inference—produced today is nearly double the number of custom XPUs built for the same tasks. By 2028, custom accelerators will likely pass GPUs in units shipped, with the gap expected to grow.1

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