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July 02, 2025

Inside Marvell’s Expanding Custom Silicon Opportunity

By Michael Kanellos, Head of Influencer Relations, Marvell

The opportunity for custom silicon isn’t just getting larger – it’s becoming more diverse.

At the Custom AI Investor Event, Marvell executives outlined how the push to advance accelerated infrastructure is driving surging demand for custom silicon – reshaping the customer base, product categories and underlying technologies. (Here is a link to the recording and presentation slides.)

Data infrastructure spending is now slated to surpass $1 trillion by 20281 with the Marvell total addressable market (TAM) for data center semiconductors rising to $94 billion by then, 26% larger than the year before. Of that total, $55.4 billion revolves around custom devices for accelerated compute1. In fact, the forecast for every major product segment has risen in the past year, underscoring the growing momentum behind custom silicon.

Marvell Data Center TAM

The deeper you go into the numbers, the more compelling the story becomes. The custom market is evolving into two distinct elements: the XPU segment, focused on optimized CPUs and accelerators, and the XPU attach segment that includes PCIe retimers, co-processors, CPO components, CXL controllers and other devices that serve to increase the utilization and performance of the entire system. Meanwhile, the TAM for custom XPUs is expected to reach $40.8 billion by 2028, growing at a 47% CAGR1.

And as demand for custom solutions grows among sovereign clouds, AI-centric service providers, and other customers, Marvell is actively engaged in 18 custom projects. These include 12 devices for the four major hyperscalers (three XPUs and nine XPU attach devices), and six devices for emerging AI customers (two XPUs and four XPU attach devices).

Marvell accelerated custom compute sockets

The rapid pace of innovation also means leapfrog advances in the materials, concepts and technologies for building accelerated infrastructure. Some of the ideas discussed in the session include:

  • Die-to-die interconnects that can transfer data between chips at up to 50 Tbps while consuming less than 0.1 picojoule per bit. “Every picojoule of savings equals 100 watts” at the system level, noted Ken Chang, senior vice president of analog and mixed signal engineering.

Marvell Die-to-Die (D2D)

  •  Custom static random access memory (SRAM) for on-chip caches that deliver 17X the bandwidth of standard SRAM, need 50% less space and 66% less standby power.
  • 4D and 4.5D packaging containing optical and copper interfaces capable of containing 16X more computing cores than conventional monolithic packaging.
    “A few years ago, advanced packaging used to be an afterthought. It has emerged as a key differentiator. It is as important as silicon if not more,” said Mayank Mayukh, senior engineer of advanced packaging at Marvell. “This is a good time to be a packaging engineer.”

Marvell advanced packaging portfolio

  • Package Integrated Voltage Regulation (PIVR) solutions that can reduce noise, improve overall performance and in-system transmission power losses by up to 85%. 

Marvell package-integrated voltage regulation (PIVR)

  • Optical SerDes speeds of 480Gbps, a new record that surpasses the 450Gbps industry first set by Marvell at OFC 2025:

Marvell breaking 500 Gbps data rate barrier

But why repeat the whole event here. Get more at the link.
 

1Marvell estimates developed from forecasts from 650 Group, Cignal AI, Dell’Oro and other research firms.

 

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This blog contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events or achievements. Actual events or results may differ materially from those contemplated in this blog. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the “Risk Factors” section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

Tags: data centers, AI, AI infrastructure, custom computing, Optical Connectivity

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